Ion beam sputtering thesis

• Comprehensive Planning, Process & Equipment Guidance
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Another common use of FIB instruments is for design verification and/or failure analysis of semiconductor devices. Design verification combines selective material removal with gas-assisted material deposition of conductive, dielectric, or insulating materials. Engineering prototype devices may be modified using the ion beam in combination with gas-assisted material deposition in order to rewire an integrated circuit's conductive pathways. The techniques are effectively used to verify the correlation between the CAD design and the actual functional prototype circuit, thereby avoiding the creation of a new mask for the purpose of testing design changes.

Abrisa Technologies is a recognized global supplier of high quality, fabricated glass components, optical thin film coatings, and custom glass solutions for a wide variety of industries. From our US based Abrisa Industrial Glass fabrication facility in Santa Paula, CA and our ZC&R Coatings for Optics division in Torrance, CA we serve diverse industries such as microelectronics and displays, semiconductor, military, automotive, aerospace, medical, biomedical and scientific R&D. We provide custom specialty flat glass and coating products for applications such as: flat panel display, touch and gesture recognition; visible to IR imaging and surveillance; entertainment, indoor and outdoor lighting; advanced instrumentation; and photonics.

We can configure systems to support several types sputter deposition such as RF sputtering, DC sputtering and Pulsed DC sputtering. Each of these deposition methods uses a process sputter gas, which is usually an inert gas like argon with reactive gases added for certain processes. Other forms of sputter depositions include ion-beam sputtering, reactive sputtering, ion-assisted sputtering, high-target utilization sputtering, gas flow sputtering, high power magnetron sputtering & facing target sputtering.  Specifically configured sources make sputtering magnetic materials such as Fe, Ni and Co much easier and support an increase in target thickness.

Ion beam sputtering thesis

ion beam sputtering thesis

We can configure systems to support several types sputter deposition such as RF sputtering, DC sputtering and Pulsed DC sputtering. Each of these deposition methods uses a process sputter gas, which is usually an inert gas like argon with reactive gases added for certain processes. Other forms of sputter depositions include ion-beam sputtering, reactive sputtering, ion-assisted sputtering, high-target utilization sputtering, gas flow sputtering, high power magnetron sputtering & facing target sputtering.  Specifically configured sources make sputtering magnetic materials such as Fe, Ni and Co much easier and support an increase in target thickness.

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